Updated to Revision E
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards.
It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements.
Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes, laminate cracks and voids, etchback, blind and buried via fill, acceptance testing and frequency, and requirements for thermal stress testing. This revision synchronizes to the IPC-A-600. For use with IPC-6011.Enquiry Form
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