Definition
Delamination is the separation of laminate plies or separation between laminate and copper or solder mask. It weakens the PCB and may lead to open circuits or corrosion.
How It Works
Heat, moisture and stress all contribute to delamination. It may appear as bubbles, cracks or layers lifting during soldering or rework. Detection is achieved with X‑ray, ultrasound or cross‑section analysis. Preventive measures include moisture control, correct profiling and careful handling during component removal.
Practical Example
During a BGA rework, excessive dwell time causes local delamination. Updated profiles and improved nozzle selection prevent repeats and preserve laminate integrity.
Context & Relevance
Delamination control is a critical factor in achieving long‑term reliability in high‑end electronics where IPC Class 3 standards apply.
Commercial Tie-In
At Rework, we deliver hands-on training and IPC certification that helps teams understand and manage Delamination. Our on-site and virtual courses are designed to improve skills, prevent defects and support reliable electronics assembly.
