Ball grid arrays are a type of surface mount packaging used to house integrated circuits. Instead of pins or leads, the underside of the package is arranged with an array of tiny solder balls, which are used to form connections between the device and the printed circuit board.
This layout allows for a higher density of connections in a compact space and helps improve electrical and thermal performance. Ball grid arrays are commonly used in applications that require reliable, high-speed signal processing, such as processors and memory chips.
During assembly or rework, correct alignment and temperature control are essential, as the solder joints are located beneath the package and cannot be visually inspected without specialist equipment.
