Showing 31–45 of 49 results
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers.Available From:£125.00 Enquiry Form
PCB + Component Kit £25.00
J-STD-001 PTH £8.00
Single QFP £2.50Available From:£2.50–£25.00 Enquiry Form
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs.Available From:£95.00 Enquiry Form
J-STD-003 prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders.Available From:£120.00 Enquiry Form
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections.Available From:£120.00 Enquiry Form
Lists requirements for qualification and characterization of solder paste.
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders.
Updated with extended support for components used for lead free assembly!
This standard addresses semiconductor flip chip design requirements.Available From:£95.00 Enquiry Form
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components.
This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling.Available From:£75.00 Enquiry Form
This updated full-colour, 18 x 24-inch (46cm x 61cm) wall poster visually defines minimum/maximum Class 2 through-hole solder joint acceptability requirements from the IPC-A-610 and J-STD-001 industry standards. Containing high-quality computer graphics, this poster depicts complex through-hole solder joint requirements so clearly, that all operators and inspectors can easily understand and apply this important criteria. Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with this highly visual learning and reference tool. This product includes one poster, for Class 2. (Also available in a Class 3 version, part number: P-PTH3.)