IPC Training Materials

Showing 31–45 of 49 results

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    IPC-T-50

    This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers.

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    Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011.

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    £120.00 Enquiry Form
  • J-STD component kit size

    J-STD-001

    PCB + Component Kit £25.00
    PCB £7.00
    J-STD-001 PTH £8.00
    SMT £12.00
    Single QFP £2.50

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    £2.50£25.00 Enquiry Form
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    J-STD-002

    This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs.

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    This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users. The Amendment 1 now included in this IPC/ECA J-STD-002C adds an appendix that defines a test protocol for wetting balance testing and also allows the use of production solder pastes of appropriate lead-based and lead free compositions for surface mount simulation testing. 63 pages. Released November 2008.

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    £95.00 Enquiry Form
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    J-STD-003

    J-STD-003 prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders.

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    This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both the surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability. Test A, Test B, Test C, Test D and Test E for tin/lead solder processes and Test A1, Test B1, Test C1, Test D1 and Test E1 for lead-free solder processes, unless otherwise agreed upon between vendor and user. Test A and Test C for tin/lead solder processes, Test A1 and Test C1 for lead-free solder processes are to be used as default solderability tests. 36 pages. Released March 2007.

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    £120.00 Enquiry Form
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    J-STD-004

    This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections.

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    This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 20 pages. Released December 2008.

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    £120.00 Enquiry Form
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    J-STD-005

    Lists requirements for qualification and characterization of solder paste.

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    Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Developed by IPC and EIA.

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    £65.00 Enquiry Form
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    J-STD-006

    This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders.

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    This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes. 29 pages. Released October 2009.Amendments 1 and 2 included in this J-STD-006 modify the following:

    • Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking,Symbols and Labels
    • Clarify the meaning of those alloys that are designated as lead-free
    • Provide guidance to suppliers how to designate and mark lead-free alloys
    • Correct the required maximum levels of lead (Pb) and antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities
    • Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes
    • Remove Table 3-1 “Particle Size Distributions of Standard Solder Powders”
    • Change the information contained in Table A-1 “Composition and Temperature Characteristics of Lead-free Solder 8. Alloys” (contained in Appendix A “Solder Alloys”) and
    • Establish a consistent maximum contaminant level requirement within Appendix B-1 for the elements of silver (Ag), lead (Pb) and antimony (Sb)

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    £65.00 Enquiry Form
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    J-STD-020

    Updated with extended support for components used for lead free assembly!

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    This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.

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    £65.00 Enquiry Form
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    J-STD-026

    This standard addresses semiconductor flip chip design requirements.

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    Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA.

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    £95.00 Enquiry Form
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    J-STD-027

    This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

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    £65.00 Enquiry Form
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    J-STD-033

    Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.

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    These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags. Developed by IPC and JEDEC.

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    £65.00 Enquiry Form
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    J-STD-035

    This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components.

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    It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC.

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    £65.00 Enquiry Form
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    J-STD-32

    This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.

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    It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. 10 pages. Released June 2002.

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    £65.00 Enquiry Form
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    J-STD-609

    This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling.

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    This standard also provides for the identification of:1) those assemblies that are assembled with lead-containing or lead-free solder;
    2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
    3) the maximum component temperature not to be exceeded during assembly or rework processing;
    4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
    5) the surface finish of PCBs; and
    6) the conformal coating on PCBAs.
    New to this revision are additional codes for the more precise specification of certain lead-free solders. 13 pages. Released February 2010.

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    £72.00 Enquiry Form
  • P-PTH2-E

    P-PTH-2

    This updated full-colour, 18 x 24-inch (46cm x 61cm) wall poster visually defines minimum/maximum Class 2 through-hole solder joint acceptability requirements from the IPC-A-610 and J-STD-001 industry standards. Containing high-quality computer graphics, this poster depicts complex through-hole solder joint requirements so clearly, that all operators and inspectors can easily understand and apply this important criteria. Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with this highly visual learning and reference tool. This product includes one poster, for Class 2. (Also available in a Class 3 version, part number: P-PTH3.)

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    £65.00 Enquiry Form