IPC Training Materials
Showing 16–30 of 49 results
This handbook is a compilation of the conformal coating industry’s practical experience, and will assist the designers and users of conformal coatings in making informed choices.Available From:£135.00 Enquiry Form
IPC-2221 is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer.
Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards.
Used in conjunction with IPC-2221, IPC-2223 establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex flexible circuits.
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits.
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables.
Establishes the requirements for adhesive coated dielectric film materials used in the cover sheets and flexible adhesive bonding films of fabricated flexible printed circuitry and flexible flat cable.Available From:£110.00 Enquiry Form
Establishes the requirements for metal-clad dielectric film materials used in flexible printed circuitry fabrication and flexible flat cable.Available From:£110.00 Enquiry Form
This specification establishes the general requirements and responsibilities for suppliers and users of printed boards.Available From:£70.00 Enquiry Form
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel.Available From:£130.00–£140.00 Enquiry Form
IPC-7351 includes both the standard and an IPC-7351 land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.
This is the first revision to the industry’s first consensus document on calculating benchmark indices for defects and quality.Available From:£70.00 Enquiry Form
This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues.
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies.