IPC Manuals & Standards
Showing 31–39 of 39 results
Lists requirements for qualification and characterization of solder paste.
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders.
Updated with extended support for components used for lead free assembly!
This standard addresses semiconductor flip chip design requirements.Available From:£95.00 Enquiry Form
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components.
This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.