IPC Manuals & Standards

Showing 16–30 of 39 results

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    IPC-4101

    This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits.

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    This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document’s user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision’s 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance.

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    £120.00 Enquiry Form
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    IPC-4202

    This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables.

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    It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. 27 pages. Released April 2010.

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    £65.00 Enquiry Form
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    IPC-4203

    Establishes the requirements for adhesive coated dielectric film materials used in the cover sheets and flexible adhesive bonding films of fabricated flexible printed circuitry and flexible flat cable.

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    Provides comprehensive data that will help users more easily determine both material capability and compatibility. IPC-4203 includes adhesive-coated flexible dielectric film material specification sheets which are identified by material type.Closely aligned with IPC-4202 and IPC-4204. Supersedes IPC-FC-232C with Amendment 1 included and, in turn, IPC-FC-232C, IPC-FC-232B, IPC-FC-232A, IPC-FC-232 and IPC-FC-233. 45 pages. Released May 2002.

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    £92.00 Enquiry Form
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    IPC-4204

    Establishes the requirements for metal-clad dielectric film materials used in flexible printed circuitry fabrication and flexible flat cable.

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    Provides comprehensive data that will more easily help users determine both material capability and compatibility. IPC-4204 includes the metal-clad dielectric film material specification sheets which are identified by material type. Closely aligned with IPC-4202 and IPC-4203. Supersedes IPC-FC-241C and, in turn, IPC-FC-241B, IPC-FC-241A and IPC-FC-241. 57 pages. Released May 2002.

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    £95.00 Enquiry Form
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    IPC-6011

    This specification establishes the general requirements and responsibilities for suppliers and users of printed boards.

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    Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met.For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C.

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    £65.00 Enquiry Form
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    IPC-7095

    Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel.

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    IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both on the BGA packages and the solder alloy used to attach it to the printed board land pattern. The major emphasis of Revision B is to provide information to those companies transitioning from the standard tin/lead reflow processes to those that use lead-free materials in the assembly of BGA type components.In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the characteristics that the industry is experiencing in the implementation of BGA assembly processes as well as void process indicators.

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    £120.00£130.00 Enquiry Form
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    IPC-7351

    IPC-7351 includes both the standard and an IPC-7351 land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.

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    The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 30-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351 Land Pattern Calculator. The IPC-7351 Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD.

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    £120.00 Enquiry Form
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    IPC-7912

    This is the first revision to the industry’s first consensus document on calculating benchmark indices for defects and quality. 

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    Finally – an end to the confusion when calculating defect opportunities for benchmarking! For customers and manufacturers, it seems like every company has a unique way of calculating defects and then reporting on quality. In a complex electronics assembly operation, is it best to calculate using the number of components? The number of leads? What about solder joints? How can companies calculate “best-in-class” with an infinite number of ways of calculating Defects Per Million Opportunities (DPMO)? The document provides consistent methodologies for calculating benchmark indices for DPMO Index, Component DPMO, Placement DPMO, Termination DPMO, and Overall Manufacturing Index (OMI). This document is for end-of-process benchmarking. Provides support for unpopulated terminations and has much clearer examples.

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    £65.00 Enquiry Form
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    IPC-CM770

    This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues.

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    It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages. Revised January 2004.

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    £120.00 Enquiry Form
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    IPC-D-279

    Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies.

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    Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.

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    £120.00 Enquiry Form
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    IPC-SM-840

    Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system.

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    IPC-SM-840 provides two classes of requirements, T and H, to re?ect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.19 pages. Released December 2010.

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    IPC-T-50

    This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers.

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    Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011.

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    £120.00 Enquiry Form
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    J-STD-002

    This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs.

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    This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users. The Amendment 1 now included in this IPC/ECA J-STD-002C adds an appendix that defines a test protocol for wetting balance testing and also allows the use of production solder pastes of appropriate lead-based and lead free compositions for surface mount simulation testing. 63 pages. Released November 2008.

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    J-STD-003

    J-STD-003 prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders.

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    This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both the surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability. Test A, Test B, Test C, Test D and Test E for tin/lead solder processes and Test A1, Test B1, Test C1, Test D1 and Test E1 for lead-free solder processes, unless otherwise agreed upon between vendor and user. Test A and Test C for tin/lead solder processes, Test A1 and Test C1 for lead-free solder processes are to be used as default solderability tests. 36 pages. Released March 2007.

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    £120.00 Enquiry Form
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    J-STD-004

    This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections.

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    This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 20 pages. Released December 2008.

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    £120.00 Enquiry Form