IPC Manuals & Standards
Showing 16–30 of 39 results
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits.
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables.
Establishes the requirements for adhesive coated dielectric film materials used in the cover sheets and flexible adhesive bonding films of fabricated flexible printed circuitry and flexible flat cable.Available From:£92.00 Enquiry Form
Establishes the requirements for metal-clad dielectric film materials used in flexible printed circuitry fabrication and flexible flat cable.Available From:£95.00 Enquiry Form
This specification establishes the general requirements and responsibilities for suppliers and users of printed boards.
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel.Available From:£120.00–£130.00 Enquiry Form
IPC-7351 includes both the standard and an IPC-7351 land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.
This is the first revision to the industry’s first consensus document on calculating benchmark indices for defects and quality.
This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues.
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies.
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system.
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers.
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs.Available From:£95.00 Enquiry Form
J-STD-003 prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders.